Display device

ABSTRACT

A display device includes a substrate including a first surface, and a second surface opposite the first surface, and defining a through portion passing therethrough, a pixel array including a plurality of pixels surrounding the through portion at the first surface, a plurality of scan lines extending along a first direction for providing scan signals to the pixels, and a plurality of data lines extending along a second direction crossing the first direction for providing data signals to the pixels, the plurality of data lines including first and second data lines adjacent the through portion at different layers, and having at least a portion thereof curved along a perimeter of the through portion.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/217,802, filed Jul. 22, 2016, which claims priority to and thebenefit of Korean Patent Application No. 10-2015-0172663, filed Dec. 4,2015, the entire content of both of which is incorporated herein byreference.

BACKGROUND 1. Field

One or more embodiments relate to a display device.

2. Description of the Related Art

Recently, the purpose of display devices has been diversified. Also, asdisplay devices become thin and lightweight, a range of use of displaydevices gradually extends. Particularly, recently, manufacture ofdisplay devices as a flat panel display devices has been researched.

Various methods may be used in designing the form of the display device.Also, functions that may be combined with, or connected to, the displaydevice increase.

SUMMARY

One or more embodiments include a display device having a throughportion.

Additional aspects will be set forth in part in the description thatfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, a display device includes asubstrate including a first surface, and a second surface opposite thefirst surface, and defining a through portion passing therethrough, apixel array including a plurality of pixels surrounding the throughportion at the first surface, a plurality of scan lines extending alonga first direction for providing scan signals to the pixels, and aplurality of data lines extending along a second direction crossing thefirst direction for providing data signals to the pixels, the pluralityof data lines including first and second data lines adjacent the throughportion at different layers, and having at least a portion thereofcurved along a perimeter of the through portion.

The first data line might not overlap the second data line.

The substrate may include a display area corresponding to the pixels,and a non-display area adjacent the display area.

The non-display area may include a first non-display area surrounded bythe display area, and surrounding the through portion, and a secondnon-display area surrounding the display area.

One of the first and second data lines may be connected with aconnection data line, the connection data line includes a same materialas an other of the first and second data line is located.

At least one of the first and second data lines may include a firststraight line portion extending along the second direction, a curvedportion connected with the first straight line portion, and a secondstraight line portion connected with the curved portion, and extendingalong the second direction.

The curved portion may be integral with the first and second straightlines at a same layer.

The device may further include an insulating layer between the curvedportion and the first or second straight line portions, the curvedportion may be at a different layer than the first or second straightline portions, the curved portion and the first straight line portionmay contact each other via a first contact passing through theinsulating layer, and the curved portion and the second straight lineportion may contact each other via a second contact passing through theinsulating layer.

The device may further include a thin film encapsulation layer includingan inorganic layer and an organic layer above the substrate.

The thin film encapsulation layer may include a lateral surface definingthe through portion.

The thin film encapsulation layer may include a first inorganic layer,an organic layer above the first inorganic layer, and a second inorganiclayer above the organic layer.

The device may further include a dam adjacent the through portion at thefirst surface of the substrate.

The dam may be located between an end of the organic layer and thethrough portion.

The first inorganic layer and the second inorganic layer may contacteach other at a contact portion, and may extend further toward thethrough portion than the organic layer.

The device may further include an inorganic insulating layer below thefirst data line and the second data line, and directly contacting thefirst inorganic layer adjacent the through portion.

The device may further include an inorganic passivation layer above thefirst data line and the second data line, and directly contacting thefirst inorganic layer adjacent the through portion.

At least one of the first and second data lines may overlap the contactportion.

The device may further include a passivation layer including anorganic-inorganic composite particle above the first and second datalines, and directly contacting the first inorganic layer adjacent thethrough portion.

At least one of the first and second data lines may overlap the contactportion.

The plurality of pixels may include a first pixel and a second pixelarranged along the second direction, spaced from each other with thethrough portion therebetween, and electrically connected with one of thefirst and second data lines.

The plurality of data lines may further include a third data lineincluding a same material as one of the first and second data lines, andspaced from the through portion along the first direction, and theplurality of pixels may further include a third pixel electricallyconnected with the third data line, and including a pixel electrode, anemission layer above the pixel electrode, and an opposite electrodeabove the emission layer.

At least one of the first and second data line may overlap the pixelelectrode of the third pixel.

Each of the pixels may include a pixel circuit including a transistorand a storage capacitor, and an organic light-emitting diodeelectrically connected with the pixel circuit.

According to the above, embodiments provide a display device thatreduces an area of a first non-display area around a through portionsurrounded by pixels, and that improves sealing performance.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the exemplary embodiments,taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram illustrating a display device according to anembodiment;

FIG. 2 is a plan view illustrating a display device according to anembodiment;

FIG. 3A is a plan view enlarging the portion IIIa of FIG. 2;

FIG. 3B is a plan view depicting a portion of FIG. 3A;

FIG. 3C is a plan view according to a modified embodiment of FIG. 3A;

FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. 3A;

FIG. 5 is a plan view enlarging the portion V of FIG. 2;

FIG. 6 is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 7 is an enlarged view illustrating the portion VII of FIG. 6;

FIG. 8 is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 9 is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 10 is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 11 is a plan view illustrating a portion of a display deviceaccording to another embodiment;

FIG. 12 is a cross-sectional view taken along the line X-X of FIG. 11;

FIG. 13A is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 13B is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 14A is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 14B is a cross-sectional view illustrating a portion of a displaydevice according to another embodiment;

FIG. 15A is a plan view depicting a portion of a display deviceaccording to another embodiment;

FIG. 15B is a plan view depicting a portion of FIG. 15A;

FIG. 16 is a cross-sectional view taken along the line XIV-XIV of FIG.15A; and

FIGS. 17A to 17C are views illustrating electronic apparatuses having adisplay device according to an embodiment.

DETAILED DESCRIPTION

Features of the inventive concept and methods of accomplishing the samemay be understood more readily by reference to the following detaileddescription of embodiments and the accompanying drawings. Hereinafter,example embodiments will be described in more detail with reference tothe accompanying drawings, in which like reference numbers refer to likeelements throughout. The present invention, however, may be embodied invarious different forms, and should not be construed as being limited toonly the illustrated embodiments herein. Rather, these embodiments areprovided as examples so that this disclosure will be thorough andcomplete, and will fully convey the aspects and features of the presentinvention to those skilled in the art. Accordingly, processes, elements,and techniques that are not necessary to those having ordinary skill inthe art for a complete understanding of the aspects and features of thepresent invention may not be described. Unless otherwise noted, likereference numerals denote like elements throughout the attached drawingsand the written description, and thus, descriptions thereof will not berepeated. In the drawings, the relative sizes of elements, layers, andregions may be exaggerated for clarity.

It will be understood that, although the terms “first,” “second,”“third,” etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondescribed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of thepresent invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofexplanation to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly.

It will be understood that when an element, layer, region, or componentis referred to as being “on,” “connected to,” or “coupled to” anotherelement, layer, region, or component, it can be directly on, connectedto, or coupled to the other element, layer, region, or component, or oneor more intervening elements, layers, regions, or components may bepresent. In addition, it will also be understood that when an element orlayer is referred to as being “between” two elements or layers, it canbe the only element or layer between the two elements or layers, or oneor more intervening elements or layers may also be present.

In the following examples, the x-axis, the y-axis and the z-axis are notlimited to three axes of a rectangular coordinate system, and may beinterpreted in a broader sense. For example, the x-axis, the y-axis, andthe z-axis may be perpendicular to one another, or may representdifferent directions that are not perpendicular to one another.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a,” “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes,” and “including,” when used inthis specification, specify the presence of the stated features,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of elements and do not modify the individual elements of thelist.

As used herein, the term “substantially,” “about,” and similar terms areused as terms of approximation and not as terms of degree, and areintended to account for the inherent deviations in measured orcalculated values that would be recognized by those of ordinary skill inthe art. Further, the use of “may” when describing embodiments of thepresent invention refers to “one or more embodiments of the presentinvention.” As used herein, the terms “use,” “using,” and “used” may beconsidered synonymous with the terms “utilize,” “utilizing,” and“utilized,” respectively. Also, the term “exemplary” is intended torefer to an example or illustration.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

The electronic or electric devices and/or any other relevant devices orcomponents according to embodiments of the present invention describedherein may be implemented utilizing any suitable hardware, firmware(e.g. an application-specific integrated circuit), software, or acombination of software, firmware, and hardware. For example, thevarious components of these devices may be formed on one integratedcircuit (IC) chip or on separate IC chips. Further, the variouscomponents of these devices may be implemented on a flexible printedcircuit film, a tape carrier package (TCP), a printed circuit board(PCB), or formed on one substrate. Further, the various components ofthese devices may be a process or thread, running on one or moreprocessors, in one or more computing devices, executing computer programinstructions and interacting with other system components for performingthe various functionalities described herein. The computer programinstructions are stored in a memory which may be implemented in acomputing device using a standard memory device, such as, for example, arandom access memory (RAM). The computer program instructions may alsobe stored in other non-transitory computer readable media such as, forexample, a CD-ROM, flash drive, or the like. Also, a person of skill inthe art should recognize that the functionality of various computingdevices may be combined or integrated into a single computing device, orthe functionality of a particular computing device may be distributedacross one or more other computing devices without departing from thespirit and scope of the exemplary embodiments of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification, and should not be interpreted in an idealizedor overly formal sense, unless expressly so defined herein.

FIG. 1 is a block diagram illustrating a display device 1 according toan embodiment.

Referring to FIG. 1, the display device 1 is an active type organiclight-emitting display device, and includes a pixel array 10, a firstscan driver 20, a second scan driver 30, and a data driver 40. Eachpixel PX includes a pixel circuit, and an organic light-emitting diode(OLED) connected to the pixel circuit.

The pixel array 10 includes a plurality of pixels PX located atintersections of a plurality of scan lines SL1 a to SLna and SL1 b toSLnb, and a plurality of data lines DL1 to DLm, the pixels PX beingarranged in a matrix configuration. In the present embodiment, theplurality of scan lines SL1 a to SLna and SL1 b to SLnb extend in afirst direction, which is a row direction, and the plurality of datalines DL1 to DLm extend in a second direction, which is a columndirection.

Each pixel PX is connected to one of the plurality of scan lines SL1 ato SLna and SL1 b to SLnb transferred to the pixel array 10. Althougheach pixel PX is connected to one scan line corresponding to a relevantpixel row in FIG. 1, the inventive concept is not limited thereto. Inanother embodiment, each pixel PX may be connected to two scan lines.

The first scan driver 20 and the second scan driver 30 may be atopposite sides of the pixel array 10, and may perform dual scanning. Forexample, the first scan driver 20 generates a scan signal, and transfersthe scan signal to some of the pixels PX, and the second scan driver 30generates a scan signal, and transfers the scan signal to others of thepixels PX. The first scan driver 20 and the second scan driver 30 may besynchronized by a synchronized clock signal.

The data driver 40 transfers data signals to respective pixels PX viathe plurality of data lines DL1 to DLm.

A controller 50 changes a plurality of externally generated imagesignals into a plurality of image data signals, and transfers theplurality of image data signals to the data driver 40. The controller 50receives a synchronization signal, and a clock signal, generates controlsignals for controlling driving of the data driver 40 and the first andsecond scan drivers 20 and 30, and transfers the control signals to thedata driver 40 and the first and second scan drivers 20 and 30.

Each pixel PX emits light having brightness (e.g., predeterminedbrightness) by using a driving current supplied to the OLED according toa data signal provided via a corresponding one of the data lines DL1 toDLm.

FIG. 2 is a plan view illustrating a display device according to anembodiment.

Referring to FIG. 2, a substrate 100 includes a display area DA and anon-display area NA.

The display area DA is a region in which the pixel array 10 is located,and an image (e.g., a predetermined image) is provided by using lightemitted by a plurality of pixels PX in the display area DA.

The substrate 100 includes a through hole (through portion) TH passingthrough the substrate 100. The through hole TH is surrounded by aplurality of pixels PX.

The non-display area NA includes a first non-display area NA1 and asecond non-display area NA2. The first non-display area NA1 surroundsthe outline of the through hole TH, and corresponds to a region betweenthe through hole TH and pixels PX adjacent the through hole TH. Thefirst non-display area NA1 is surrounded by the display area DA. Thesecond non-display area NA2 surrounds the outline of the display areaDA. The first non-display area NA1 is separated from the secondnon-display area NA2 by a portion of the display area DA.

The first and second scan drivers 20 and 30 are in the secondnon-display area NA2. The first and second scan drivers 20 and 30 arespaced apart from each other with the pixel array 10 of the display areaDA therebetween. A scan signal generated from the first scan driver 20is provided to some of the pixels PX via scan lines SLia (i=1, 2, . . ., n), and a scan signal generated from the second scan driver 30 isprovided to some of the pixels PX via scan lines SLib (i=1, 2, . . . ,n).

A pad portion PAD is located in the second non-display area NA2. Thedata driver 40 (see FIG. 1) may be mounted in a form of an integratedcircuit (IC) above the pad portion PAD. Data signals generated by thedata driver 40 are provided to respective pixels PX via data lines DLj(j=1, 2, . . . , m).

Although FIG. 2 illustrates a case where the through hole TH is formedin the upper right portion of the display device 1, the inventiveconcept is not limited thereto. The through hole TH may be located inthe display device 1, may be surrounded by pixels PX, and a specificlocation thereof is not limited.

Although FIG. 2 illustrates a case where the through hole TH has acircular shape, and where only one through hole TH is formed, theinventive concept is not limited thereto. The through hole TH may havevarious shapes, including a polygon, such as a quadrangle, or anellipse, and a number of the through holes TH is not limited.

Similarly, although FIG. 2 illustrates a case where the firstnon-display area NA1 surrounding the through hole TH has a circularshape according to the shape of the through hole TH, the inventiveconcept is not limited thereto. The first non-display area NA1 may havevarious shapes, including a polygon, such as a quadrangle, or anellipse, and is not limited thereto.

Although FIG. 2 illustrates a case where the display area DA has aquadrangular shape, the inventive concept is not limited thereto. Thedisplay area DA may have various shapes, including a polygon, such as atriangle and a pentagon, or a circle or an ellipse.

FIG. 3A is a plan view enlarging the portion IIIa of FIG. 2, FIG. 3B isa plan view depicting a portion of FIG. 3A, FIG. 3C is a plan viewillustrating a modified embodiment of FIG. 3A, FIG. 4 is across-sectional view taken along the line IV-IV of FIG. 3A, and FIG. 5is a plan view enlarging the portion V of FIG. 2.

Referring to FIG. 3A, a plurality of pixels PX are around the throughhole TH, and respective pixels PX are connected with a respective one ofthe scan lines SLia or SLib (i=1, 2, . . . , n) and a respective one ofthe data lines DLj (j=1, 2, . . . , m) to receive a scan signal and adata signal.

The plurality of scan lines SLia and SLib (i=1, 2, . . . , n) extend inthe first direction, and a scan line SLia or SLib extending toward thethrough hole TH may be disconnected (or cut) around the through hole TH(e.g., may terminate near the through hole TH due to the presencethereof). A portion of a scan line SLia cut around the through hole THthat is located to the left of the through hole TH receives a scansignal from the first scan driver 20 (see FIG. 2), and transfers thereceived scan signal to a relevant pixel PX, and a portion of a scanline SLib cut around the through hole TH that is located to the right ofthe through hole TH receives a scan signal, and/or may receive anemission control signal, from the second scan driver 30 (see FIG. 2),and transfers the received signal(s) to a relevant pixel PX.

Some data lines DLj−3 to DLj+2 from among a plurality of data lines DLj(j=1, 2, . . . , m) extend in the second direction, and are curved alongthe outline of the through hole TH at one side thereof in the firstnon-display area NA1. Other data lines DL1, . . . , DLj−4, DLj+3, . . ., DLm are spaced apart from the through hole TH, and extend in thesecond direction in the display area DA.

The other data lines DL1, . . . , DLj−4, DLj+3, . . . , DLm spaced apartfrom the through hole TH extend in a straight line along the seconddirection, and provide a data signal to pixels PX of a relevant pixelcolumn. The data lines DLj−3 to DLj+2 curved along the through hole THprovide a data signal to respective pixels PX on opposite sides of thethrough hole TH along the second direction.

For example, as illustrated in FIG. 3B, of pixels PX spaced from eachother along the second direction with the through hole TH therebetween,a first pixel PX1 and a second pixel PX2 respectively on the upper sideand the lower side of the through hole TH receive a data signal via thecurved data line DLj. The curved data line DLj includes a first straightportion/straight line portion SP1, a curved portion CP connected withthe first straight line portion SP1 and curved in the first non-displayarea NA1, and a second straight portion/straight line portion SP2connected with the curved portion CP. The first straight line portionSP1, the curved portion CP, and the second straight line portion SP2 maybe integrally formed at the same layer. Although FIG. 3 describes onecurved data line DLj, other data lines DLj−3 to DLj−1, DLj+1, and DLj+2curved along the through hole TH may have the same or similar shape.

Although FIGS. 3A and 3B illustrate a case where the curved data linesDLj−3 to DLj+2 are curved with the same curvature, the inventive conceptis not limited thereto. In another embodiment, as illustrated in FIG.3C, the curved data lines DLj−3 to DLj+2 may have different curvatures.

Referring to FIGS. 3A and 4, pixels PX are around the through hole TH,which passes through the substrate 100, are above a first surface 100 aof the substrate 100, and are sealed by a thin film encapsulation layer130.

The substrate 100 may include a material, such as glass, metal, or anorganic material. According to an embodiment, the substrate 100 mayinclude a flexible material. For example, the substrate 100 may includea material such as polyimide (PI), which may be warped, bent, or rolled,but this is exemplary and an embodiment is not limited thereto.

A plurality of pixels PX are located in the display area DA of thesubstrate 100. Each pixel PX includes a pixel circuit 110, and an OLED120 that is electrically connected with the pixel circuit 110. The OLED120 includes a pixel electrode 121 above a planarization layer 109, anopposite electrode 123, and an intermediate layer 122 therebetween thatincludes an organic emission layer. The planarization layer 109 includesan organic material.

The non-display area NA1 of the substrate 100 surrounds a through areaTA corresponding to the through hole TH. The data lines DLj−3 to DLj+2are located in the first non-display area NA1. As described withreference to FIGS. 3A and 3B, the data lines DLj−3 to DLj+2 provide adata signal to pixels PX located above and below the through hole TH (ina plan view), and are curved in the first non-display area NA1 (in aplan view).

Some of the curved data lines DLj−3 to DLj+2 are located in differentlayers. The curved data lines DLj−3 to DLj+2 may be alternately aboveand below an organic passivation layer 108. Because the curved datalines DLj−3 to DLj+2 are alternately located at different layers, apitch between the data lines DLj−3 to DLj+2 may be reduced, so that anoccupying ratio of (e.g., the overall size of) the first non-displayarea NA1 in the substrate 100 may be reduced.

To reduce parasitic capacitance occurring therebetween, the data linesDLj−3 to DLj+2 located at different layers might not overlap each other.

A thin film encapsulation layer 130 is above the display area DA and thefirst non-display area NA1 of the substrate 100. The thin filmencapsulation layer 130 may prevent penetration of external oxygen andmoisture into pixels PX and various wirings including the data linesDLj.

The thin film encapsulation layer 130 may entirely cover the displayarea DA and the first non-display area NA1 of the substrate 100, and mayform a lateral surface that defines the through hole TH.

Referring to FIGS. 2, 4, and 5, the data lines DLj−3, DLj−1, and DLj+1located below the organic passivation layer 108, which are from amongthe data lines that are alternately located at different layers, may beconnected to a connection data line CDL (e.g., a respective connectiondata line CDL). A contact CNT (e.g., a respective contact CNT) betweenthe data lines DLj−3, DLj−1, DLj+1 and the connection data line CDL maybe located in the second non-display area NA2. The connection data lineCDL located in the second non-display area NA2 may serve as a link lineconnecting a data driver mounted in the pad portion PAD with the datalines DLj−3, DLj−1, and DLj+1.

Although the present embodiment illustrates a case where the contact CNTbetween the data lines DLj−3, DLj−1, DLj+1 and the connection data lineCDL is located in the second non-display area NA2, the inventive conceptis not limited thereto. In another embodiment, the contact CNT may belocated in the first non-display area NA1 or the display area DA.

Although FIG. 5 illustrates a case where the data lines DLj−3, DLj−1,and DLj+1 located below the organic passivation layer 108 from among thedata lines DLj−3 to DLj+2 located in different layers may be connectedto a connection data line CDL, the present embodiment is not limitedthereto. Alternatively, the connection data line CDL may be connectedwith the data lines DLj−2, DLj and DLj+2 located above the organicpassivation layer 108.

FIG. 6 is a cross-sectional view illustrating a portion of a displaydevice 1A according to another embodiment, and FIG. 7 is an enlargedview illustrating the portion VII of FIG. 6. In the display device 1A ofFIG. 6, like the display device 1 as described above with reference toFIG. 4, pixels PX on both sides of a through hole TH have the samestructure. Therefore, for convenience of description, FIG. 6 extractsand illustrates the right side of the through hole TH of the displaydevice 1A.

Referring to FIG. 6, a pixel PX including a pixel circuit 110, whichincludes a first thin film transistor T1, a second thin film transistorT2, and a storage capacitor Cst, and including the OLED 120 electricallyconnected with the pixel circuit 110, is formed in a display area DA.

A buffer layer 101 is above the substrate 100. The buffer layer 101 mayreduce or block penetration of foreign substances, moisture, or externalair from below the substrate 100, and may provide a planarized surface.The buffer layer 101 may include an inorganic material, such as an oxideor a nitride, and may include a single layer or multi layers includingan inorganic material.

The first thin film transistor T1 is a driving thin film transistor, andincludes an active layer A1, a gate electrode G1, a source electrode S1,and a drain electrode D1. The second thin film transistor T2 is aswitching thin film transistor, and includes an active layer A2, a gateelectrode G2, a source electrode S2, and a drain electrode D2. Thesource electrode S2 of the second thin film transistor T2 is connectedwith the data line DLj+3. Although the present embodiment illustratesthe top-gate type thin film transistors in which the gate electrodes G1and G2 are respectively above the active layers A1 and A2 with a gateinsulating layer 103 therebetween, the first and second thin filmtransistors T1 and T2 may instead be bottom-gate type thin filmtransistors, according to another embodiment.

The active layers A1 and A2 may include amorphous silicon orpolycrystalline silicon. According to another embodiment, the activelayers A1 and A2 may include an oxide of at least one of In, Ga, Sn, Zr,V, Hf, Cd, Ge, Cr, Ti, and/or Zn.

The gate electrodes G1 and G2 may include a low resistance metallicmaterial. For example, the gate electrodes G1 and G2 may include aconductive material including Mo, Al, Cu, Ti, etc., and may includemulti layers or a single layer including the above material.

The gate insulating layer 103 may include an inorganic materialincluding an oxide or a nitride. For example, the gate insulating layer103 may include SiOx, SiNx, SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO2, etc.

The source electrodes S1 and S2 and the drain electrodes D1 and D2 mayinclude a material having excellent conductivity. For example, thesource electrodes S1 and S2 and the drain electrodes D1 and D2 mayinclude a conductive material including Mo, Al, Cu, Ti, etc., and mayinclude multi layers or a single layer including the above material.According to an embodiment, the source electrodes S1 and S2 and thedrain electrodes D1 and D2 may include multi layers including Ti/Al/Ti.

The storage capacitor Cst may include a lower electrode C1 and an upperelectrode C2 located in different layers, with a first interlayerinsulating layer 105 therebetween, and may overlap each other. Thestorage capacitor Cst may overlap the first thin film transistor T1.

The lower electrode C1 of the storage capacitor Cst may be at the samelayer as, or may be the same as, the gate electrode G1 of the first thinfilm transistor T1, and may include the same material as that of thegate electrode G1. For example, the gate electrode G1 of the first thinfilm transistor T1 may serve as the lower electrode C1 of the storagecapacitor Cst.

The upper electrode C2 of the storage capacitor Cst is between the gateelectrode G1, the source electrode S1, and the drain electrode D1 of thefirst thin film transistor T1. The upper electrode C2 may include aconductive material including Mo, Al, Cu, Ti, etc., and may includemulti layers or a single layer including the above material. Accordingto an embodiment, the upper electrode C2 may include multi layersincluding Mo/Al/Mo.

The first interlayer insulating layer 105 may include an inorganicmaterial including an oxide or a nitride. For example, the firstinterlayer insulating layer 105 may include SiOx, SiNx, SiON, Al2O3,TiO2, Ta2O5, HfO2, ZnO2, etc.

A second interlayer insulating layer 107 is between the upper electrodeC2 of the storage capacitor Cst and the source/drain electrodes S1, S2,D1, D2, and includes an inorganic material including an oxide or anitride. For example, the second interlayer insulating layer 107 mayinclude SiOx, SiNx, SiON, Al2O3, TiO2, Ta2O5, HfO2, ZnO2, etc.

The OLED 120 may be located above the planarization layer 109, and maybe electrically connected with the first thin film transistor T1 byusing a mediation metal ML.

The planarization layer 109 may include a general polymer, such as polymethyl methacrylate (PMMA) and poly styrene (PS), polymer derivativeshaving a phenol-based group, an acryl-based polymer, an imide-basedpolymer, an aryl ether-based polymer, an amide-based polymer, afluorine-based polymer, a p-xylene based polymer, a vinyl alcohol-basedpolymer, and/or a blend of these.

The pixel electrode 121 of the OLED 120 may be a (semi) transparentelectrode or a reflective electrode. The (semi) transparent electrodemay include, for example, indium tin oxide (ITO), indium zinc oxide(IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide(IGO), or aluminum zinc oxide (AZO). The reflective electrode mayinclude a reflective layer including Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir,Cr, and/or a compound thereof, and may further include a layer includingITO, IZO, ZnO, and/or In2O3 above the reflective layer.

The intermediate layer 122 of the OLED 120 includes an organic emissionlayer emitting, for example, red, green, and/or blue light. In anotherembodiment, the organic emission layer may emit white light. Theintermediate layer 122 may further include at least one of a holetransport layer (HTL), a hole injection layer (HIL), an electrontransport layer (ETL), and/or an electron injection layer (EIL).

The opposite electrode 123 of the OLED 120 may be a reflective electrodeor a (semi) transparent electrode. The reflective electrode may includeat least one of, for example, Li, Ca, LiF/Ca, LiF/Al, Al, Ag, and/or Mg.The (semi) transparent electrode may include a layer including Li, Ca,LiF/Ca, LiF/Al, Al, Ag, Mg, and/or a compound thereof, and may furtherinclude a layer including a (semi) transparent material, such as ITO,IZO, ZnO, In2O3, etc., above the layer. Although not shown, a cappinglayer may additionally be above the opposite electrode 123.

As described with reference to FIGS. 2 to 4, the data lines DLj to DLj+2curved along the outline (e.g., circumference, or perimeter) of thethrough hole TH are in the first non-display area NA1. Becauserespective ones of the data lines DLj to DLj+2 are in different layerswith the organic passivation layer 108 therebetween, a pitch betweenadjacent data lines may be reduced, and thus the area of the firstnon-display area NA1 may also be reduced, as described above.

The organic passivation layer 108 may include a general polymer such aspoly methyl methacrylate (PMMA) and poly styrene (PS), polymerderivatives having a phenol-based group, an acryl-based polymer, animide-based polymer, an aryl ether-based polymer, an amide-basedpolymer, a fluorine-based polymer, a p-xylene based polymer, a vinylalcohol-based polymer, and/or a blend of these.

A dam 114 is located in the first non-display area NA1 of the substrate100. The dam 114 prevents an organic material from flowing toward thethrough hole TH during a process of forming an organic layer 133 of thinfilm encapsulation layer 130.

The dam 114 may include an organic material. According to an embodiment,the dam 114 may be formed by forming the organic passivation layer 108,the planarization layer 109, and a pixel-defining layer 112, and thenpatterning a stacked structure of these layers. While the dam 114 isformed, a portion of the upper surface of the second interlayerinsulating layer 107 may be exposed.

The thin film encapsulation layer 130 may entirely cover the substrate100, and may have a structure in which an inorganic layer and an organiclayer are alternately stacked. According to an embodiment, the thin filmencapsulation layer 130 may include a first inorganic layer 131, anorganic layer 133, and a second inorganic layer 135 sequentiallystacked.

The first inorganic layer 131 and the second inorganic layer 135 mayinclude a metallic oxide, a metallic nitride, a metallic carbide, and acompound thereof. For example, the first inorganic layer 131 and thesecond inorganic layer 135 may include at least one inorganic materialfrom among Al2O3, TiO2, Ta2O5, HfO2, ZnO2, SiOx, AlON, AlN, SiON, and/orSi3N4.

The organic layer 133 may include a polymer-based material. Examples ofthe polymer-based material include an acryl-based resin, an epoxy-basedresin, polyimide, polyethylene, etc. The organic layer 133 may alleviateinternal stress of the first inorganic layer 131 and the secondinorganic layer 135, or may supplement/correct a defect of the firstinorganic layer 131 and/or the second inorganic layer 135, and planarizethe first inorganic layer 131 and the second inorganic layer 135.

Because the dam 114 blocks flowing of an organic material toward thethrough hole TH while the organic layer 133 is formed, an end of theorganic layer 133 may be located inside the dam 114 (e.g., at a regionopposite to the through hole TH with respect to the dam 114).

The first inorganic layer 131 and the second inorganic layer 135 extendfurther toward the through hole TH than the organic layer 133. The firstinorganic layer 131 and the second inorganic layer 135 directly contacteach other at the outside of the dam 114 (e.g., at a region between thethrough hole TH and the dam 114), and may form the lateral surfacedefining the through hole TH. A portion where the first inorganic layer131 and the second inorganic layer 135 directly contact each other isreferred to as a contact portion SA hereinafter.

Referring to FIGS. 6 and 7, because the first inorganic layer 131 andthe second inorganic layer 135 directly contact each other in a regionadjacent the through hole TH, and because the first inorganic layer 131directly contacts the second interlayer insulating layer 107 includingan inorganic material, penetration of moisture along an interfacialdirection between these layers 131 and 135 may be reduced or prevented.

The planarization layer 109 includes an organic material, and coversdata lines DLj to DLj+2 located in the first non-display area NA1. Theplanarization layer 109, which is an organic material, has low moisturebarrier performance. A penetration possibility of moisture is reducedvia the above-described contact portion SA and contact structure betweenthe contact portion SA and the second interlayer insulating layer 107.However, if moisture should penetrate via an interface between theplanarization layer 109 and a layer that contacts the planarizationlayer 109, the data lines DLj to DLj+2 may be damaged.

To reduce or remove this possibility, the curved data lines DLj to DLj+2may be inside the dam 114 in the first non-display area NA1. The datalines DLj to DLj+2 may be spaced apart from the through hole TH suchthat the dam 114 and the contact portion SA are located between thecurved data lines DLj to DLj+2 and the through hole TH, so that thelikelihood of moisture penetration may reduce even more.

FIG. 8 is a cross-sectional view illustrating a portion of a displaydevice 1B according to another embodiment. The display device 1B of FIG.8 is different from the display device 1A described with reference toFIGS. 6 and 7 in that the organic passivation layer 108 between thesource/drain electrodes S1, S2, D1, D2, and the pixel electrode 121 isomitted, and the structure and location of the curved data lines DLj toDLj+2 are different. For convenience of description, points differentfrom the embodiment described with reference to FIGS. 6 and 7 are mainlydescribed.

Referring to FIG. 8, data lines DLj to DLj+2 curved along theoutline/perimeter of the through hole TH may be in the first non-displayarea NA1, and some data lines DLj and DLj+2 from among the data linesDLj to DLj+2 may be above the planarization layer 109, while the otherdata line DLj+1 of the data lines DLj to DLj+2 may be below theplanarization layer 109. The pixel-defining layer 112 may cover the datalines DLj to DLj+2.

According to an embodiment, some data lines DLj and DLj+2 from among thecurved data lines above the planarization layer 109 may include a firstlayer L1 and a second layer L2.

The first layer L1 may include the same material as a mediation metalML. The second layer L2 may include the same material as the pixelelectrode 121. The first layer L1 and the second layer L2 may includedifferent materials, respectively.

Although the present embodiment describes a case where some data linesDLj and DLj+2 include two layers, the inventive concept is not limitedthereto. In another embodiment, some data lines DLj and DLj+2 mayinclude only the first layer L1.

The pixel-defining layer 112 includes an organic material, and coversthe data lines DLj to DLj+2 located in the first non-display area NA1.The pixel-defining layer 112, which is an organic material, has lowmoisture barrier performance. A penetration possibility of moisture isreduced due to the contact portion SA, and due to a contact structurebetween the contact portion SA and the second interlayer insulatinglayer 107. However, if moisture should penetrate via an interfacebetween the pixel-defining layer 112 and a layer contact thepixel-defining layer 112, the data lines DLj to DLj+2 may be damaged.

To reduce or remove this possibility, the curved data lines DLj to DLj+2may be inside the dam 114 in the first non-display area NA1. The datalines DLj to DLj+2 may be spaced apart from the through hole TH suchthat the dam 114 and the contact portion SA are located between thecurved data lines DLj to DLj+2 and the through hole TH, so that thepenetration possibility of moisture may reduce even more.

FIG. 9 is a cross-sectional view illustrating a portion of a displaydevice 1C according to another embodiment. Compared with the displaydevice 1B described with reference to FIG. 8, some data lines DLj andDLj+2 of the display device 1C are different. For convenience ofdescription, points different from the embodiment described withreference to FIG. 8 are mainly described.

Referring to FIG. 9, the data lines DLj and DLj+2 located above theplanarization layer 109 from among the curved data lines DLj to DLj+2are at the same layer as the pixel electrode 121, and include the samematerial as the pixel electrode 121. Because some data lines DLj andDLj+2 include the same material as, and are at a same layer as, thepixel electrode 121, a number of masks may reduce during a manufacturingprocess.

FIG. 10 is a cross-sectional view illustrating a portion of a displaydevice 1D according to another embodiment. Compared with the displaydevice 1A described with reference to FIGS. 6 and 7, the display device1D of FIG. 10 is different from the display device 1A in that theorganic passivation layer 108 located between the source/drainelectrodes S1, S2, D1, D2, and the pixel electrode 121 is omitted, andthe structure and location of the curved data lines DLj to DLj+2 aredifferent. For convenience of description, points different from theembodiment described with reference to FIGS. 6 and 7 are mainlydescribed.

Referring to FIG. 10, the data line DLj+1 from among the curved datalines DLj to DLj+2 may be at a same layer as the source and drainelectrodes Si and D1 of the first thin film transistor T1, and mayinclude the same material as the source and drain electrodes S1 and D1.The other data lines DLj and DLj+2 of the data lines DLj to DLj+2 may beat a same layer as the upper electrode C2 of the storage capacitor Cst,and may include the same material as the upper electrode C2.

Because some data lines DLj and DLj+2 include the same material as, andare at the same layer as, the upper electrode C2 of the storagecapacitor Cst, a number of masks may be reduced during a manufacturingprocess.

FIG. 11 is a plan view illustrating a portion of a display device 1Eaccording to another embodiment, and FIG. 12 is a cross-sectional viewtaken along the line X-X of FIG. 11. Compared with the display device 1Adescribed with reference to FIGS. 6 and 7, the locations of the datalines DLj to DLj+2 of the display device 1E of FIGS. 11 and 12 aredifferent. For convenience of description, points different from theembodiment described with reference to FIGS. 6 and 7 are mainlydescribed.

Referring to FIGS. 11 and 12, the curved data lines DLj to DLj+2 arealternately located in different layers, but are located in the displayarea DA instead of the first non-display area NA1.

The curved data lines DLj to DLj+2 may apply a data signal to pixels PX1and PX2 spaced apart from each other along the second direction with thethrough hole TH therebetween. The curved data lines DLj to DLj+2 mayoverlap the pixel electrode 121 of a third pixel PX3. The third pixelPX3 is connected to, and receives a data signal from, a data line DLj+3that is spaced apart from the through hole TH and that extends in astraight line along the second direction. The data line DLj+3 connectedto the third pixel PX3 is located at a same layer as the data lineDLj+1.

Because the curved data lines DLj to DLj+2 overlap the pixel electrode121 of the third pixel PX3 connected with the data line DLj+3 that isspaced apart from the through hole TH, the dam 114 may be located inrelative isolation in the first non-display area NA1 of the substrate100. Accordingly, an occupying ratio of, or a relative size of, thefirst non-display area NA1 in the substrate 100 may reduce.

FIG. 13A is a cross-sectional view illustrating a portion of a displaydevice 1F according to another embodiment. Compared with the displaydevice 1A described with reference to FIGS. 6 and 7, the display device1F of FIG. 13A further includes an inorganic passivation layer 108 acovering the curved data lines DLj to DLj+2. Furthermore, a relationwith the contact portion SA is different. For convenience ofdescription, points different from the embodiment described withreference to FIGS. 6 and 7 are mainly described.

Referring to FIG. 13A, the inorganic passivation layer 108 a is abovethe substrate 100 to cover the curved data lines DLj to DLj+2. Theinorganic passivation layer 108 a may include an inorganic materialincluding an oxide or a nitride. For example, the inorganic passivationlayer 108 a may include SiOx, SiNx, SiON, Al2O3, TiO2, Ta2O5, HfO2,ZnO2, etc.

The curved data lines DLj and DLj+2 are covered with the inorganicpassivation layer 108 a while directly contacting the inorganicpassivation layer 108 a. The inorganic passivation layer 108 a includingan inorganic material has excellent moisture barrier performancecompared with the planarization layer 109, which is an organic material.Therefore, even when a distance between the curved data lines DLj toDLj+2 and the through hole TH is reduced, barrier performance, ormoisture penetration prevention performance, does not deteriorate. Inthis case, an occupying ratio of the first non-display area NA1 in thesubstrate 100 may be reduced without deteriorating the moisturepenetration prevention performance.

As a distance between the curved data lines DLj to DLj+2 and the throughhole TH reduces, at least one data line DLj, or a portion thereof, fromamong the curved data lines DLj to DLj+2 may overlap the dam 114 and acontact portion SA between the first inorganic layer 131 and the secondinorganic layer 135.

FIG. 13B is a cross-sectional view illustrating a portion of a displaydevice 1F′ according to another embodiment. Compared with the displaydevice 1F described with reference to FIG. 13A, the structure andlocation of the curved data lines DLj to DLj+2 of the display device 1F′of FIG. 13B are different, and the organic passivation layer 108 isomitted. For convenience of description, points different from theembodiment described with reference to FIG. 13A are mainly described.

Referring to FIG. 13B, data line DLj+1 may at a same layer as, and mayinclude the same material as, the source and drain electrodes S1 and D1of the first thin film transistor T1. The other data lines DLj and DLj+2may be at a same layer as, and may include the same material as, theupper electrode C2 of the storage capacitor Cst. Accordingly, a numberof masks may be reduced.

Furthermore, because the inorganic passivation layer 108 a covers thecurved data lines DLj to DLj+2, as described with reference to FIG. 13A,an occupying ratio of the first non-display area NA1 in the substrate100 may be reduced without deteriorating the moisture penetrationprevention performance, as described above.

FIG. 14A is a cross-sectional view illustrating a portion of a displaydevice 1G according to another embodiment. The display device 1G of FIG.14A is a modified example of the display device 1F of FIG. 13A, and isdifferent from the display device 1F of FIG. 13A in that the curved datalines DLj to DLj+2 are covered with, and directly contact, a passivationlayer 108 b including organic-inorganic composite particles instead ofthe inorganic passivation layer 108 a.

The passivation layer 108 b including organic-inorganic compositeparticles is an organic layer including acryl, polyolefin, polyimide(PI), polyurethane, polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), polybutylene terephthalate (PBT), polyethersulfone(PES), etc., and has a structure in which organic-inorganic compositeparticles are formed in a free volume of these organic layers. Thepassivation layer 108 b including organic-inorganic composite particlesmay be formed by forming an organic layer, and by then performing asequential vapor infiltration process.

The curved data lines DLj to DLj+2 are covered with, and directlycontact, the passivation layer 108 b including organic-inorganiccomposite particles. The inorganic passivation layer 108 b includingorganic-inorganic composite particles has excellent moisture barrierperformance when compared with the planarization layer 109, which is anorganic material. Therefore, even when a distance between the curveddata lines DLj to DLj+2 and the through hole TH is reduced, moisturepenetration prevention performance is maintained. In this case, anoccupying ratio of the first non-display area NA1 in the substrate 100may be reduced without deteriorating the moisture penetration preventionperformance.

As a distance between the curved data lines DLj to DLj+2 and the throughhole TH decreases, at least one data line DLj from among the curved datalines DLj to DLj+2, or a portion thereof, may overlap the dam 114 and acontact portion SA between the first inorganic layer 131 and the secondinorganic layer 135.

FIG. 14B is a cross-sectional view illustrating a portion of a displaydevice 1G′ according to another embodiment. Compared with the displaydevice 1G described with reference to FIG. 14A, the structure andlocation of the curved data lines DLj to DLj+2 of the display device 1G′of FIG. 14B are different, and the organic passivation layer 108 isomitted. For convenience of description, points different from theembodiment described with reference to FIG. 14A are mainly described.

Referring to FIG. 14B, data line DLj+1 from among the curved data linesDLj to DLj+2 may be at a same layer as, and may include the samematerial as, the source and drain electrodes S1 and D1, and the otherdata lines DLj and DLj+2 of the curved data lines DLj to DLj+2 may be ata same layer as, and may include the same material as, the upperelectrode C2 of the storage capacitor Cst. Accordingly, a number ofmasks may be reduced.

Furthermore, because the passivation layer 108 b includingorganic-inorganic composite particles covers the curved data lines DLjto DLj+2, as described with reference to FIG. 14A, a size/occupyingratio of the first non-display area NA1 in the substrate 100 may bereduced without deteriorating the moisture penetration preventionperformance as described above.

FIG. 15A is a plan view depicting a portion of a display device 1Haccording to another embodiment, FIG. 15B is a plan view depicting aportion of FIG. 15A, and FIG. 16 is a cross-sectional view taken alongthe line XIV-XIV of FIG. 15A.

The display device 1H of FIGS. 15A, 15B, and 16 is different from thedisplay device 1 described with reference to FIGS. 3A, 3B, and 4, inthat portions forming each of the curved data lines DLj−3 to DLj+2 arelocated in different layers. For convenience of description, pointsdifferent from the embodiment described with reference to FIGS. 3A, 3B,and 4 are mainly described.

Referring to FIGS. 15A, 15B, and 16, the curved data lines DLj−3 toDLj+2 are alternately in different layers. However, as illustrated inFIG. 15B, a curved portion CP forming one data line DLj is at adifferent layer than first and second straight line portions SP1 andSP2. The first straight line portion SP1 is connected with the curvedportion CP via a first contact hole CNT1, and the second straight lineportion SP2 is connected with the curved portion CP via a second contacthole CNT2.

First and second straight line portions SP1 and SP2 of each of thecurved data lines DLj−3 to DLj+2 may be above and below the organicpassivation layer 108. According to an embodiment, the first and secondstraight line portions SP1 and SP2 of each of data lines DLj−2 and DLj+1may at the same layer as the source and drain electrodes S1, S2, D1, D2located below the organic passivation layer 108. The first and secondstraight line portions SP1 and SP2 of the other data lines DLj−3, DLj−1,DLj, and DLj+2 may be at a layer between the pixel electrode 121 and thesource and drain electrodes S1, S2, D1, D2 located above the organicpassivation layer 108.

Meanwhile, as illustrated in FIG. 16, a curved portion CP of the datalines DLj−2 and DLj+1 may be at a same layer as the lower electrode C1of the storage capacitor Cst, and a curved portion CP of each of theother data lines DLj−3, DLj−1, DLj, and DLj+2 may at a same layer as theupper electrode C2 of the storage capacitor Cst.

As illustrated in FIG. 16, in the case where the curved portions CP arealternately in the layer in which the upper and lower electrodes C1 andC2 of the storage capacitor Cst are, the relevant data lines DLj−3 toDLj+2 are covered with the second interlayer insulating layer 107, whichis an inorganic layer, while directly contacting the second interlayerinsulating layer 107. The second interlayer insulating layer 107, whichis an inorganic layer, has excellent moisture barrier performance.Therefore, even when a spaced distance between the curved data linesDLj−3 to DLj+2 and the through hole TH is reduced, the moisturepenetration prevention performance is maintained. In this case, anoccupying ratio of the first non-display area NA1 in the substrate 100may reduce without deteriorating the moisture penetration preventionperformance.

In an embodiment, at least partial data lines DLj−2, DLj−1, DLj, DLj+2from among the curved data lines DLj−3 to DLj+2 may overlap the dam 114and the contact portion SA.

FIGS. 17A to 17C are views illustrating electronic apparatuses having adisplay device according to an embodiment.

Referring to FIG. 17A, a display device according to the aboveembodiments may be provided to a mobile phone 1000. A pixel array of thedisplay device according to the above embodiments may form a display1100 of the mobile phone 1000, and a part 1200, such as a camera, may belocated inside the through hole TH.

The location of the through hole TH is not limited to the locationillustrated in FIG. 17A. For example, in another embodiment, the throughhole TH may be formed in the lower central portion of the display of themobile phone 1000. In this case, a button may be located inside thethrough hole TH.

Referring to FIG. 17B, a display device according to the aboveembodiments may be provided to a smart watch 2000. A pixel array of thedisplay device according to the above embodiments may form a display2100 of the smart watch 2000, and a driving part DU, which may include aminute hand and an hour hand, may be located inside the through hole TH.

Referring to FIG. 17C, a display device according to the aboveembodiments may be provided to a dashboard 3000 for a vehicle. A pixelarray of the display device according to the above embodiments may forma display 3100 of the dashboard 3000 for a vehicle, and the through holeTH may be provided in plural.

According to an embodiment, a first driving part DU1 including a handindicating revolutions per minute (RPM), and a second driving part DU2including a hand indicating a velocity, may be provided to through holesTH, respectively.

Although the inventive concept has been described with reference toexemplary embodiments illustrated in the drawings, these are providedfor an exemplary purpose only, and one of ordinary skill in the art willunderstand that various modifications and other equivalent embodimentsmay be made therein. Therefore, the spirit and scope of the inventiveconcept should be defined by the following claims and their functionalequivalents.

What is claimed is:
 1. A display device comprising: a substrate having athrough hole; a plurality of pixels on the substrate, the plurality ofpixels being arranged around the through hole; a plurality of scan linesextending along a first direction and being configured to provide scansignals to the pixels; and a plurality of data lines extending along asecond direction crossing the first direction and being configured toprovide data signals to the pixels, the plurality of data linescomprising first and second data lines adjacent to the through hole,each of the first and second data lines comprising a section curvedalong a perimeter of the through hole; an insulation layer interposedbetween the first data line and the second data line in a thicknessdirection that is orthogonal to the first and second directions.
 2. Thedevice of claim 1, wherein the first data line or the second data linecomprises at least one selected from Mo, Al, Ti, and Cu.
 3. The deviceof claim 2, wherein the first data line or the second data linecomprises a first Ti layer, an Al layer, and a second Ti layer.
 4. Thedevice of claim 1, wherein the first data line and the second data linedo not overlap each other.
 5. The device of claim 1, wherein theinsulation layer comprises an organic insulation material or aninorganic insulation material.
 6. The device of claim 1, wherein thesubstrate comprises: a display region corresponding to the plurality ofpixels; and a non-display region between the through hole and thedisplay region.
 7. The device of claim 1, wherein the first data linecomprises: first and second sections being spaced apart from each other;and a third section connecting the first section to the second section.8. The device of claim 7, wherein the insulation layer is interposedbetween the third section of the first data line and the first andsecond sections of the first data line, and wherein the third section isconnected to the first section via a first contact hole in theinsulation layer, and the third section is connected to the secondsection via a second contact hole in the insulation layer.
 9. The deviceof claim 1, each of the plurality of pixels comprises an organic lightemitting diode.
 10. The device of claim 1, further comprising acomponent in the through hole.
 11. The device of claim 10, wherein thecomponent comprises a camera.
 12. A display device comprising: asubstrate comprising a first region; a plurality of pixels on thesubstrate, the plurality of pixels being arranged around the firstregion; a plurality of scan lines extending along a first direction andbeing configured to provide scan signals to the pixels; and a pluralityof data lines extending along a second direction crossing the firstdirection and being configured to provide data signals to the pixels,the plurality of data lines comprising first and second data linesadjacent to the first region, wherein the first and second data lineseach comprise a section curved around the first region; and aninsulation layer interposed between the section of the first data lineand the section of the second data line in a thickness direction that isorthogonal to the first and second directions.
 13. The device of claim12, further comprising a component corresponding to the first region.14. The device of claim 13, wherein the component is configured toreceive light.
 15. The device of claim 14, wherein the componentcomprises a camera.
 16. The device of claim 12, wherein the first dataline or the second data line comprises at least one selected from Mo,Al, Ti, and Cu.
 17. The device of claim 16, wherein the first data lineor the second data line comprises a first Ti layer, an Al layer, and asecond Ti layer.
 18. The device of claim 12, wherein the section of thefirst data line and the section of the second data line do not overlapeach other.
 19. The device of claim 12, wherein each of the plurality ofpixels comprises an organic light emitting diode.
 20. The device ofclaim 12, wherein the substrate has a through hole in the first region.